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OVERVIEW

LEIMSA - Lightweight Electronics by Injection Molding in Seamless Architecture - aims at developing disruptive components for automotive interiors, integrating IMD (In-Mold Decoration), IML (In-Mold Labelling) and IME (In-Mold Electronics) technologies to achieve smart and haptic 3D surfaces, with attractive designs and immersive HMI (Human-Machine Interface) for a complete user-centred experience.

COPROMOTORES

Simoldes Plásticos (Promoter), Celoplás, Bosch, Universidade do Minho and DTx CoLAB

PERIOD

2020-08 - 2023-06

OVERALL FINANCING

€ 3.036.914,62

 

CEiiA FINANCING

​€ 538.838,66

CO-FINANCED BY

LEIMSA

CEiiA © 2020. All rights reserved.

Locations

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